14th Semiconductor Equipment, Materials and Core Parts Exhibition (CSEAC 2026)

The 14th Semiconductor Equipment, Materials and Core Parts Exhibition (CSEAC 2026) will be held from August 31 to September 2, 2026, at Taihu International Expo Center in Wuxi. As a major semiconductor trade show in China, the event focuses on semiconductor equipment, materials, and core parts across the upstream and midstream semiconductor manufacturing chain. With 1,300 exhibitors, 120,000 visitors, and 70,000 square meters of exhibition space, CSEAC 2026 provides a large-scale B2B platform for wafer manufacturing, packaging and testing, photolithography, front-end and back-end materials, and critical subsystem technologies. Built around the goals of professionalism, industrialization, and internationalization, the exhibition is positioned as a high-value platform for technology exchange, business negotiation, market expansion, and industry collaboration.

Exhibition highlights:

• Large-Scale Semiconductor Industry Platform – CSEAC 2026 brings together more than 1,300 exhibitors from around the world, creating a major sourcing and networking platform for the semiconductor industry.
• Focused Coverage of Equipment, Materials, and Core Parts – The exhibition is dedicated to key segments including wafer fabrication equipment, packaging and testing systems, materials, and upstream core components.
• Strong Industry Reputation and Resource Base – Over the years, CSEAC has built recognition for its professionalism, industry influence, and access to high-quality industry resources.
• Technology Exchange and Market Development Value – The event is designed to support technology exchange, business negotiations, product promotion, and new market development for domestic and international participants.
• Extensive Concurrent Forum Program – More than 20 concurrent forums will gather industry leaders, technical experts, and senior executives to discuss core process technologies, equipment trends, and supply chain development.
• Industry-University-Research Integration – The show emphasizes collaboration among industry, research institutions, and universities, supporting innovation and talent development across the semiconductor ecosystem.
• Alignment with International Standards – CSEAC highlights key technology areas while aiming to align with international industry standards and global semiconductor development trends.
• Ecosystem and Talent Activation – In addition to product sourcing, the event supports broader ecosystem building through talent exchange, roadshows, and cross-sector collaboration activities.

Exhibition highlights:

• Wafer Fabrication Technology Platform – The show provides focused access to suppliers and technologies for wafer manufacturing, process equipment, and advanced materials.
• Advanced Packaging and Testing Focus – Dedicated content and product coverage support sourcing and knowledge exchange in integrated circuit packaging and testing.
• Core Parts and Subsystems Relevance – The event is highly relevant for buyers and manufacturers working with vacuum systems, precision motion systems, gas delivery systems, RF power supplies, and testing systems.
• Process Technology Forum Depth – Concurrent seminars cover etching, thin-film deposition, advanced cleaning, measurement, and bonding technologies, making the show valuable for technical and R&D teams.
• AI and Smart Manufacturing Integration – Forum content includes discussions on artificial intelligence, smart manufacturing, industrial robots, and semiconductor equipment innovation.
• Supply Chain Security and Localization Themes – Several sessions address supply chain resilience, cross-industry collaboration, and strategic development paths for semiconductor manufacturing.
• Executive and Ecosystem-Level Networking – Programs such as the Global Semiconductor CEO Forum and ecosystem innovation conferences add high-level strategic value for exhibitors and visitors.
• Premium Session Access for Overseas Visitors – International attendees can access paid technical sessions free of charge after badge upgrade verification onsite.

Key products to be presented at the trade show:

• Wafer Manufacturing Equipment
• Packaging and Testing Equipment
• Core Components and Consumables
• Front-End Materials
• Back-End Materials
• Photolithography Equipment
• Semiconductor Displays
• Plant Facilities and Pollution Control

An exhibition for those engaged in these industries:

• Wafer Manufacturing Plants
• Packaging and Testing Plants
• Plant Managers
• Equipment and Materials Purchasing Directors
• Process and R&D Managers
• Equipment Engineers
• Semiconductor Equipment Agents
• Semiconductor Materials Agents
• Distributors
• System Integrators
• Company Owners
• Purchasing Managers
• Technical Support Managers
• Automotive Electronics Manufacturers
• New Energy and Industrial Control Manufacturers
• Communications and AIoT Manufacturers
• Semiconductor Core Parts Manufacturers
• Vacuum System Manufacturers
• Precision Motion System Manufacturers
• Gas Delivery System Manufacturers
• RF Power Supply Manufacturers
• Testing and Measurement System Manufacturers
• Electronic Manufacturing Services Providers
• Electronic Chemical Suppliers
• Carrier and Substrate Material Suppliers

Visitor Benefits (You can get the following benefits after review and confirmation by the organizer):

• Complimentary Session Access for International Visitors – Overseas attendees can receive free admission to paid technical sessions.
• Premium Badge Upgrade – Present your international round-trip flight itinerary at the onsite registration desk to upgrade your badge for premium session access at no extra cost.

Meet semiconductor equipment suppliers, materials manufacturers, core parts providers, and advanced packaging professionals in Wuxi and register now for free for The 14th Semiconductor Equipment, Materials and Core Parts Exhibition (CSEAC 2026).